2022 saw the rise of RISC-V designs adoption as companies worldwide are adopting the designs for their next-gen high end automotive solutions. The global MCU sales will reach a record high of USD 21.5 Billion in 2022 with automotive MCU segment growth expected to outpace most of the other end-use categories.
This year, the RISC-V Taipei Day will target on Net Zero Emissions with focus on Electric Vehicles and Smart Vehicles. The forum will invite international and domestic experts share their insights on RISC-V and how the flexibility and scalability of RISC-V can help in the diverse development of automotive systems and solutions. Join us as we welcome the possibilities of high-end RISC-V automotive solutions.
Global Chief Marketing Officer and President
Chairman and CEO
Intel Foundry Services, RISC-V Enablement
President and CTO
Senior Manager, Product Marketing
Senior Principal and Application Engineer
Microchip Technology Inc.
Senior Technical Staff Engineer FPGA Applications,
Analyst and Research Manager
Dr. Wang is president of Powerchip Technology Corporation in Taiwan. Prior to joining Powerchip in 2005, he was General Manager of Memory Group at Winbond Electronics. Dr. Wang has more than 30 years experience in the semiconductor industry encompassing technology and product development, and business and corporate management. He had start-up experience as CEO and president of Programmable Microelectronics Corp. in San Jose, California. Dr. Wang had also previously worked for Fairchild, Intel and Samsung.
Dr. Wang received B.S. in Physics at National Taiwan University, and Ph.D. in Physics at University of Illinois at Urbana-Champaign.
As the Global Chief Marketing Officer and President of SEMI Taiwan, Terry Tsao leads global marketing activities at SEMI, including strategic, operational, product, and communications marketing. Tsao also oversees the association’s programs, products, and services in Taiwan, and he is also responsible for relationships with SEMI members as well as with representatives of local industry, government, and academia. Additionally, he supports SEMI international programs serves members worldwide. He also managed SEMI South East Asia operation for 6 years as the President of SEMI South East Asia.
Prior to joining SEMI, Tsao was Managing Director of International Data Corporation in Taiwan. He has also served as APAC Marketing Director for Trend Micro, and held various management positions in Far Eastone Telecommunications, and Ogilvy.
Tsao holds an MBA from Baruch College City University, New York, and an Executive MBA from National Taiwan University.
Calista Redmond is the CEO of RISC-V International with a mission to expand and engage RISC-V stakeholders, compel industry adoption, and increase visibility and opportunity for RISC-V within and beyond RISC-V International. Prior to RISC-V International, Calista held a variety of roles at IBM, including Vice President of IBM Z Ecosystem where she led strategic relationships across software vendors, system integrators, business partners, developer communities, and broader engagement across the industry. Focus areas included execution of commercialization strategies, technical and business support for partners, and matchmaker to opportunities across the IBM Z and LinuxOne community. Calistas background includes building and leading strategic business models within IBMs Systems Group through open source initiatives including OpenPOWER, OpenDaylight, and Open Mainframe Project. While at IBM, she also drove numerous acquisition and divestiture missions, and several strategic alliances. Prior to IBM, she was an entrepreneur in four successful start-ups.
Frankwell Lin, Chairman of Andes Technology, started his career being as application engineer in United Microelectronics Corporation (UMC) while UMC was an IDM with its own chip products, he experienced engineering, product planning, sales, and marketing jobs with various product lines in UMC. In 1995, after four years working on CPU chip product line as business director, he was transferred to UMC-Europe branch office to be its GM when UMC reshaped to do wafer foundry service, he lead UMC-Europe to migrate itself from selling IDM products to selling wafer foundry service. In 1998, after 14 years working in UMC, Frankwell switched job to work in Faraday Technology Corporation (Faraday), he lead ASIC business development as starting, then on-and-off leading ASIC implementation, chip backend service, IP business development, industry relationship development (IR), as well as Faraday's spokesperson, in 2004, he started to lead the CPU project spin off operation of Faraday. Frankwell became co-founder of Andes Technology Corporation in 2005 when it was found up, he formally took position to be Andes' President since 2006 and got promoted as Chairman and CEO in 2021.
Frankwell received BSEE degree of Electrophysics from the National Chiao-Tung University, Taiwan, and MSEE degree of Electrical and Computer Engineering from Portland State University, Oregon, USA. Under his management, Andes has been recognized as one of leading suppliers of embedded CPU IP in semiconductor industry. Andes also won the reputation of leading technology company with awards such like 2012 EE Times worldwide Silicon 60 Hot Startups to Watch, 2015 the Deloitte Technology Fast 500 Asia Pacific award, etc. Frankwell received accolade award of Outstanding Technology Management Performance, Taiwan, in 2015 and ERSO award in 2020 for his contribution to the high-tech industry. Frankwell is also the Board Director of RISC-V International since 2020.
Gary Martz is the Sr. Director for RISC-V Enablement at Intel Corporation. Responsible for assessing RISC-V industry needs, collecting Intel Foundry Services RISC-V customer requirements, and aligning Intel's RISC-V specification and open source project contributions. Gary has extensive experience successfully driving technical standards and open source projects spanning wireless, consumer IoT, and industrial solutions. Prior to his current role Gary was the director of standards and open source in Intel's Industrial Solutions Division and a board member at the Open Process Automation Forum. Additionally, in previous roles Gary was a founding member of the Open Connectivity Foundation, board member at the OPC Foundation Field Level Communications steering committee, board member at the Open Mobile Alliance, and board member at the Wi-Fi Alliance. Gary holds a Bachelor of Science degree in Industrial Engineering from the University of Washington ('95) and an MBA from the University of Michigan's Ross School of Business ('00).
Dr. Charlie Su is the first employee of Andes. He is in charge of product development and technical marketing. He spent over 12 years in the Silicon Valley with various technical and management positions at Sun Microsystems, Afara Websystems, C-Cube Microsystems, SGI/MIPS, and Intergraph. He made key contributions to several successful processors such as the Sun multi-core multi-threading Ultrasparc T1 and T2 processors, the C-Cube high-performance E-series MPEG media processors, the MIPS out-of-order R10K processor, and the Intergraph Clipper VLIW processor. Prior to starting Andes, he led the CPU and DSP development in Faraday Technology as Chief Architect.
Tommy Lin has been worked in the semiconductor industry for more than 2 decades on fields around the CPU, with experiences on development tools design, hardware-software co-design, embedded system and firmware development, operating system and middleware integrations, proejct and product management of SDK and CPU IP, market research and analysis to CPU related applications, and ecosystem partnership buildup. His interdisciplinary experiences cover product research and development, project management, product management, leading the company-level project to automotive certification and a high-performance CPU IP product. Tommy received a M.S. degree of Computer Science and Information Engineering from the National Tsing-Hua University, the Multidisciplinary Management of Technology Training Program (2005) by the National Chengchi University and the Ministry of Economic Affairs, and a M.B.A. degree of Management of Technology from the National Chiao-Tung University.
Vishakh Rayapeta is a senior technical staff engineer for the FPGA group at Microchip Technology Inc. Based in Taiwan, Vishakh works in the applications engineering team focusing on solutions development and customer support for the Greater China region.
Vishakh has over 20 years of experience in the Electronic Design Automation (EDA) and semiconductor industry. Before joining Microchip, Vishakh worked as an applications engineer at Synplicity supporting ASIC and FPGA physical synthesis tools.
Vishakh holds a master’s degree in Computer Engineering from University of California, Santa Barbara.
Industry Analyst, main study filed: Asia IT industry supply chain, consumer electronics, display.
National Cheng Kung University
Adjunct Professor, Department of Computer Science and Information Engineering